UPD2364EC — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

UPD2364EC: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.519 INCHES MAXIMUM IN, body_height: 0.225 INCHES MAXIMUM IN, body_length: 1.300 INCHES NOMINAL IN, memory_capacity: UNKNOWN, features_provided: 3-STATE OUTPUT AND POSITIVE OUTPUTS AND MONOLITHIC, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-266-3207, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

UPD2364EC

NSN: 5962-01-266-3207
FSC: 5962 — Microcircuits, Electronic
CAGE: 33297 — NEC ELECTRONICS USA INC ELECTRONIC ARRAYS DIV (USA)

SPECIFICATIONS

body_width	0.519 INCHES MAXIMUM IN
body_height	0.225 INCHES MAXIMUM IN
body_length	1.300 INCHES NOMINAL IN
memory_capacity	UNKNOWN
features_provided	3-STATE OUTPUT AND POSITIVE OUTPUTS AND MONOLITHIC
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 60.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-266-3207

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.519 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.225 INCHES MAXIMUM IN

•

FEATURES PROVIDED: 3-STATE OUTPUT AND POSITIVE OUTPUTS AND MONOLITHIC

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.519 INCHES MAXIMUM IN
BODY HEIGHT	0.225 INCHES MAXIMUM IN
FEATURES PROVIDED	3-STATE OUTPUT AND POSITIVE OUTPUTS AND MONOLITHIC
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.300 INCHES NOMINAL IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is UPD2364EC?

UPD2364EC is a MICROCIRCUIT,MEMORY.

What parts can replace UPD2364EC?

There is 1 known substitute for UPD2364EC: ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for UPD2364EC?

UPD2364EC is cataloged in the U.S. Government catalog under NSN 5962-01-266-3207. This indicates validated use in U.S. government and defense supply chains.

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