UPD2167 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

UPD2167: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.290 INCHES NOMINAL IN, body_height: 0.065 INCHES NOMINAL IN, body_length: 0.425 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND W/ENABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-267-8169, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

UPD2167

NSN: 5962-01-267-8169
FSC: 5962 — Microcircuits, Electronic
CAGE: 4T165 — NEC ELECTRONICS U S A INC ELECTRON DIV (USA)

SPECIFICATIONS

body_width	0.290 INCHES NOMINAL IN
body_height	0.065 INCHES NOMINAL IN
body_length	0.425 INCHES NOMINAL IN
features_provided	HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND W/ENABLE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	17 INPUT
inclosure_configuration	LEADLESS FLAT PACK
NSN	5962-01-267-8169

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 17 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.290 INCHES NOMINAL IN

•

BODY HEIGHT: 0.065 INCHES NOMINAL IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND W/ENABLE

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	17 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.290 INCHES NOMINAL IN
BODY HEIGHT	0.065 INCHES NOMINAL IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND W/ENABLE
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
MEMORY DEVICE TYPE	RAM
BODY LENGTH	0.425 INCHES NOMINAL IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 5

795066-1Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

10133816Reference document

Same NSN cross-reference

Reference document — Informative reference only

CY7C167-55Reference document

Same NSN cross-reference

Reference document — Secondary reference

P4C167L-55LMBSame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

IDT6167LA55LBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is UPD2167?

UPD2167 is a MICROCIRCUIT,MEMORY.

What parts can replace UPD2167?

There are 5 known substitutes for UPD2167: 795066-1, 10133816, CY7C167-55 and 2 more. Substitute compatibility should be verified for your specific system.

What is the NSN for UPD2167?

UPD2167 is cataloged in the U.S. Government catalog under NSN 5962-01-267-8169. This indicates validated use in U.S. government and defense supply chains.

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