UPB8259AC: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.520 INCHES NOMINAL IN, body_height: 0.170 INCHES MAXIMUM IN, body_length: 1.500 INCHES MAXIMUM IN, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR, inclosure_material: PLASTIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-367-6177, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.520 INCHES NOMINAL IN |
| body_height | 0.170 INCHES MAXIMUM IN |
| body_length | 1.500 INCHES MAXIMUM IN |
| output_logic_form | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| inclosure_material | PLASTIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -0.0 TO 70.0 CELSIUS DEGC |
| input_circuit_pattern | 14 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| design_function_and_quantity | 1 CONTROL, INTERRUPT |
| NSN | 5962-01-367-6177 |
| INPUT CIRCUIT PATTERN | 14 INPUT |
| INCLOSURE MATERIAL | PLASTIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 CONTROL, INTERRUPT |
| BODY WIDTH | 0.520 INCHES NOMINAL IN |
| BODY HEIGHT | 0.170 INCHES MAXIMUM IN |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY LENGTH | 1.500 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |