The MICROCIRCUIT is a the manufacturer industrial component. Key specifications include body_width: 0.291 INCHES MAXIMUM IN, body_height: 0.199 INCHES MAXIMUM IN, body_length: 0.785 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System under NSN 5962-00-409-2943, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.291 INCHES MAXIMUM IN |
| body_height | 0.199 INCHES MAXIMUM IN |
| body_length | 0.785 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| body_outside_diameter | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN |
| input_circuit_pattern | 4 INPUT |
| end_item_identification | RADAR SET TYPE AN/FPS-115 |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-00-409-2943 |
| TIME RATING PER CHACTERISTIC | 50000.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | CAN |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 40.0 VOLTS MAXIMUM POWER SOURCE |
| BODY OUTSIDE DIAMETER | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| INCLOSURE MATERIAL | GLASS AND METAL |
| MAXIMUM POWER DISSIPATION RATING | 800.0 MILLIWATTS |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| TERMINAL TYPE AND QUANTITY | 10 PIN |