The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.260 INCHES MAXIMUM IN, body_height: 0.070 INCHES MAXIMUM IN, body_length: 0.260 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-450-7210, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.260 INCHES MAXIMUM IN |
| body_height | 0.070 INCHES MAXIMUM IN |
| body_length | 0.260 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | DUAL 4 INPUT |
| inclosure_configuration | FLAT PACK |
| design_function_and_quantity | 2 GATE, NAND-NOR |
| NSN | 5962-00-450-7210 |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS |
| DESIGN FUNCTION AND QUANTITY | 2 GATE, NAND-NOR |
| INCLOSURE CONFIGURATION | FLAT PACK |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| BODY WIDTH | 0.260 INCHES MAXIMUM IN |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| BODY LENGTH | 0.260 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.070 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |