Academic EU only (END USER) MINDJET MINDMANAGER MEDIA O NO LICS KEY. Key specifications include body_width: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN, body_length: 1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE AND HIGH SPEED, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-145-3115, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN |
| body_height | 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN |
| body_length | 1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN |
| memory_capacity | UNKNOWN |
| features_provided | HERMETICALLY SEALED AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE AND HIGH SPEED |
| output_logic_form | METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 125.0 CELSIUS DEGC |
| operating_temp_range | +0.0 TO 70.0 CELSIUS DEGC |
| input_circuit_pattern | 14 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| NSN | 5962-01-145-3115 |
| MAXIMUM POWER DISSIPATION RATING | 790.0 MILLIWATTS |
| INPUT CIRCUIT PATTERN | 14 INPUT |
| OPERATING TEMP RANGE | +0.0 TO 70.0 CELSIUS DEGC |
| FEATURES PROVIDED | HERMETICALLY SEALED AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE AND HIGH SPEED |
| MEMORY CAPACITY | UNKNOWN |
| TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| MEMORY DEVICE TYPE | ROM |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.0 VOLTS MAXIMUM POWER SOURCE |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE MATERIAL | CERAMIC |