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TT8000582-017 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

TT8000582-017: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MINIMUM AND 0.350 INCHES MAXIMUM IN, body_height: 0.160 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND W/ENABLE AND MONOLITHIC AND ELECTROSTATIC SENSITIVE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, precious_material: GOLD. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-178-8175, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
TT8000582-017
NSN: 5962-01-178-8175
FSC: 5962 — Microcircuits, Electronic
CAGE: 07187 — HONEYWELL INTERNATIONAL INC. DBA HONEYWELL INTERNATIONAL (USA)
SPECIFICATIONS
body_width0.310 INCHES MINIMUM AND 0.350 INCHES MAXIMUM IN
body_height0.160 INCHES MAXIMUM IN
body_length1.060 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND W/ENABLE AND MONOLITHIC AND ELECTROSTATIC SENSITIVE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
precious_materialGOLD
inclosure_materialCERAMIC AND GLASS
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern10 INPUT
NSN5962-01-178-8175
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN TT8000582-017 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 10 INPUT
•
INCLOSURE MATERIAL: CERAMIC AND GLASS
•
TERMINAL SURFACE TREATMENT: GOLD
•
PRECIOUS MATERIAL: GOLD
•
BODY WIDTH: 0.310 INCHES MINIMUM AND 0.350 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.160 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND W/ENABLE AND MONOLITHIC AND ELECTROSTATIC SENSITIVE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN10 INPUT
INCLOSURE MATERIALCERAMIC AND GLASS
TERMINAL SURFACE TREATMENTGOLD
PRECIOUS MATERIALGOLD
BODY WIDTH0.310 INCHES MINIMUM AND 0.350 INCHES MAXIMUM IN
BODY HEIGHT0.160 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND W/ENABLE AND MONOLITHIC AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEROM
BODY LENGTH1.060 INCHES MAXIMUM IN
SUBSTITUTES & CROSS-REFERENCES 2
ROM/PROM FAMILY 010Reference document
Same NSN cross-reference
Reference document — Secondary reference
8001329-409Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is TT8000582-017?
TT8000582-017 is a MICROCIRCUIT,MEMORY.
What parts can replace TT8000582-017?
There are 2 known substitutes for TT8000582-017: ROM/PROM FAMILY 010, 8001329-409. Substitute compatibility should be verified for your specific system.
What is the NSN for TT8000582-017?
TT8000582-017 is cataloged in the U.S. Government catalog under NSN 5962-01-178-8175. This indicates validated use in U.S. government and defense supply chains.
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