TS68C000MFB/C12: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 1.133 INCHES NOMINAL IN, body_height: 0.135 INCHES NOMINAL IN, body_length: 1.133 INCHES NOMINAL IN, features_provided: BURN IN, MIL-STD-883, CLASS B AND HERMETICALLY SEALED AND LOW POWER, output_logic_form: HI-PERFORMANCE MOS, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-447-1667, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 1.133 INCHES NOMINAL IN |
| body_height | 0.135 INCHES NOMINAL IN |
| body_length | 1.133 INCHES NOMINAL IN |
| features_provided | BURN IN, MIL-STD-883, CLASS B AND HERMETICALLY SEALED AND LOW POWER |
| output_logic_form | HI-PERFORMANCE MOS |
| inclosure_material | CERAMIC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | FLAT PACK |
| terminal_type_and_quantity | 68 FLAT LEADS |
| design_function_and_quantity | 1 MICROPROCESSOR |
| part_name_assigned_by_controlling_agency | MICROPROCESSOR LOW POWER |
| voltage_rating_and_type_per_characteristic | 5.0 VOLTS NOMINAL INPUT/OUTPUT DIFFERENTIAL |
| NSN | 5962-01-447-1667 |
| INCLOSURE MATERIAL | CERAMIC |
| DESIGN FUNCTION AND QUANTITY | 1 MICROPROCESSOR |
| BODY WIDTH | 1.133 INCHES NOMINAL IN |
| BODY HEIGHT | 0.135 INCHES NOMINAL IN |
| FEATURES PROVIDED | BURN IN, MIL-STD-883, CLASS B AND HERMETICALLY SEALED AND LOW POWER |
| INCLOSURE CONFIGURATION | FLAT PACK |
| BODY LENGTH | 1.133 INCHES NOMINAL IN |
| OUTPUT LOGIC FORM | HI-PERFORMANCE MOS |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL INPUT/OUTPUT DIFFERENTIAL |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
No substitute or cross-reference records for this part.