TS-4138-1 — MICROCIRCUIT,HYBRID

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

TS-4138-1: MICROCIRCUIT,HYBRID.

The MICROCIRCUIT,HYBRID is a the manufacturer industrial component. Key specifications include body_width: 1.245 INCHES MINIMUM AND 1.255 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.245 INCHES MINIMUM AND 1.255 INCHES MAXIMUM IN, features_provided: HYBRID AND HERMETICALLY SEALED AND BURN IN AND W/CLOCK, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-128-6832, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

TS-4138-1

NSN: 5962-01-128-6832
FSC: 5962 — Microcircuits, Electronic
CAGE: 54485 — MICROSEMI CORP.- MASSACHUSETTS DBA MICROSEMI LAWRENCE (USA)

SPECIFICATIONS

body_width	1.245 INCHES MINIMUM AND 1.255 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	1.245 INCHES MINIMUM AND 1.255 INCHES MAXIMUM IN
features_provided	HYBRID AND HERMETICALLY SEALED AND BURN IN AND W/CLOCK
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
hybrid_technology_type	MONOLITHIC
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	44 PIN
NSN	5962-01-128-6832

COMPONENT DIAGRAM

KEY FEATURES

•

HYBRID TECHNOLOGY TYPE: MONOLITHIC

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 CENTRAL PROCESSOR UNIT

•

BODY WIDTH: 1.245 INCHES MINIMUM AND 1.255 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HYBRID AND HERMETICALLY SEALED AND BURN IN AND W/CLOCK

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

TECHNICAL CHARACTERISTICS

HYBRID TECHNOLOGY TYPE	MONOLITHIC
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 CENTRAL PROCESSOR UNIT
BODY WIDTH	1.245 INCHES MINIMUM AND 1.255 INCHES MAXIMUM IN
BODY HEIGHT	0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	HYBRID AND HERMETICALLY SEALED AND BURN IN AND W/CLOCK
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
CURRENT RATING PER CHARACTERISTIC	385.30 MILLIAMPERES MAXIMUM SUPPLY
BODY LENGTH	1.245 INCHES MINIMUM AND 1.255 INCHES MAXIMUM IN

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

2275375Reference document

Same NSN cross-reference

Reference document — Secondary reference

1040596Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is TS-4138-1?

TS-4138-1 is a MICROCIRCUIT,HYBRID.

What parts can replace TS-4138-1?

There are 2 known substitutes for TS-4138-1: 2275375, 1040596. Substitute compatibility should be verified for your specific system.

What is the NSN for TS-4138-1?

TS-4138-1 is cataloged in the U.S. Government catalog under NSN 5962-01-128-6832. This indicates validated use in U.S. government and defense supply chains.

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TS-4138-1 — MICROCIRCUIT,HYBRID

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