TS-1021: SEMICONDUCTOR DEVICE,DIODE.
The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, body_width: 4.000 INCHES MAXIMUM IN, body_height: 4.940 INCHES MAXIMUM IN, body_length: 4.690 INCHES MAXIMUM IN, overall_width: 0.750 INCHES NOMINAL IN, inclosure_type: HERMETICALLY SEALED. This part is cataloged in the U.S.
Government catalog under NSN 5950-00-553-3565, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| body_width | 4.000 INCHES MAXIMUM IN |
| body_height | 4.940 INCHES MAXIMUM IN |
| body_length | 4.690 INCHES MAXIMUM IN |
| overall_width | 0.750 INCHES NOMINAL IN |
| inclosure_type | HERMETICALLY SEALED |
| overall_height | 0.500 INCHES NOMINAL IN |
| overall_length | 2.000 INCHES NOMINAL IN |
| mounting_method | UNTHREADED HOLE(S) |
| frequency_rating | 60.0 HERTZ NOMINAL SINGLE COMPONENT |
| nominal_thread_size | 0.250 INCHES SINGLE GROUP IN |
| reliability_indicator | NOT ESTABLISHED |
| NSN | 5950-00-553-3565 |
| OVERALL HEIGHT | 5.410 INCHES NOMINAL IN |
| MOUNTING FACILITY QUANTITY | 4 SINGLE GROUP |
| INCLOSURE TYPE | HERMETICALLY SEALED |
| CENTER TO CENTER DISTANCE BETWEEN MOUNTING FACILITIES PARALLEL TO LENGTH | 3.000 INCHES NOMINAL SINGLE MOUNTING FACILITY SINGLE CENTER GROUP IN |
| INPUT-OUTPUT PHASE RELATIONSHIP | SINGLE PHASE TO SINGLE PHASE SINGLE COMPONENT |
| MOUNTING METHOD | THREADED HOLE(S) SINGLE GROUP |
| BODY WIDTH | 4.000 INCHES MAXIMUM IN |
| BODY HEIGHT | 4.940 INCHES MAXIMUM IN |
| WINDING FUNCTION AND QUANTITY | 1 PRIMARY AND 1 SECONDARY SINGLE COMPONENT |
| WINDING SHIELDING METHOD | INTERNAL SHIELD GROUNDED TO INCLOSURE AND CORE SINGLE COMPONENT |