TR162-02A: TRANSISTOR.
The TRANSISTOR is a the manufacturer industrial component. Key specifications include overall_width: 0.535 INCHES MINIMUM AND 0.545 INCHES MAXIMUM IN, overall_height: 0.249 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, overall_length: 0.790 INCHES MINIMUM AND 0.800 INCHES MAXIMUM IN, mounting_method: TERMINAL AND UNTHREADED HOLE(S), special_test_features: ENVIRONMENTAL STRESS SCREENING, internal_configuration: FIELD EFFECT. This part is cataloged in the U.S.
Government catalog under NSN 5961-01-381-8445, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| overall_width | 0.535 INCHES MINIMUM AND 0.545 INCHES MAXIMUM IN |
| overall_height | 0.249 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| overall_length | 0.790 INCHES MINIMUM AND 0.800 INCHES MAXIMUM IN |
| mounting_method | TERMINAL AND UNTHREADED HOLE(S) |
| special_test_features | ENVIRONMENTAL STRESS SCREENING |
| internal_configuration | FIELD EFFECT |
| semiconductor_material | SILICON |
| mounting_facility_quantity | 1 |
| terminal_type_and_quantity | 3 UNINSULATED WIRE LEAD |
| power_rating_per_characteristic | 100.0 WATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| current_rating_per_characteristic | 7.00 AMPERES MAXIMUM DRAIN CURRENT AND 28.00 AMPERES MAXIMUM OFF-STATE CURRENT, PEAK |
| voltage_rating_in_volts_per_characteristic | 500.0 MINIMUM BREAKDOWN VOLTAGE, DRAIN-TO-SOURCE, WITH ALL OTHER TERMINALS SHORT-CIRCUITED TO SOURCE AND 20.0 MAXIMUM GATE TO SOURCE VOLTAGE |
| NSN | 5961-01-381-8445 |
| OVERALL HEIGHT | 0.249 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 500.0 MINIMUM BREAKDOWN VOLTAGE, DRAIN-TO-SOURCE, WITH ALL OTHER TERMINALS SHORT-CIRCUITED TO SOURCE AND 20.0 MAXIMUM GATE TO SOURCE VOLTAGE |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 CELSIUS JUNCTION DEGC |
| MOUNTING FACILITY QUANTITY | 1 |
| JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-254 |
| SPECIAL TEST FEATURES | ENVIRONMENTAL STRESS SCREENING |
| MOUNTING METHOD | TERMINAL AND UNTHREADED HOLE(S) |
| SEMICONDUCTOR MATERIAL | SILICON |
| OVERALL LENGTH | 0.790 INCHES MINIMUM AND 0.800 INCHES MAXIMUM IN |
| INTERNAL CONFIGURATION | FIELD EFFECT |