The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.600 INCHES MAXIMUM IN, body_height: 0.145 INCHES MINIMUM AND 0.187 INCHES MAXIMUM IN, body_length: 1.235 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN, bit_quantity: 16384, word_quantity: 2048, memory_capacity: UNKNOWN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-086-2717, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.600 INCHES MAXIMUM IN |
| body_height | 0.145 INCHES MINIMUM AND 0.187 INCHES MAXIMUM IN |
| body_length | 1.235 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN |
| bit_quantity | 16384 |
| word_quantity | 2048 |
| memory_capacity | UNKNOWN |
| special_features | ERASABLE |
| features_provided | PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND HIGH SPEED AND STATIC OPERATION |
| output_logic_form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| NSN | 5962-01-086-2717 |
| OPERATING TEMP RANGE | +0.0 TO 70.0 CELSIUS DEGC |
| MEMORY DEVICE TYPE | ROM |
| MAXIMUM POWER DISSIPATION RATING | 540.0 MILLIWATTS |
| BIT QUANTITY | 16384 |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| BODY WIDTH | 0.590 INCHES NOMINAL IN |
| INCLOSURE MATERIAL | CERAMIC |
| BODY LENGTH | 1.290 INCHES MAXIMUM IN |
| OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |