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TMPZ84C015BF-6 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

TMPZ84C015BF-6: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: HIGH PERFORMANCE AND LOW POWER AND HIGH SPEED, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, memory_device_type: RAM, operating_temp_range: -40.0 TO 85.0 CELSIUS DEGC, inclosure_configuration: FLAT PACK, terminal_type_and_quantity: 100 FLAT LEADS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-381-2383, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
TMPZ84C015BF-6
NSN: 5962-01-381-2383
FSC: 5962 — Microcircuits, Electronic
CAGE: 61802 — TOSHIBA INTERNATIONAL CORPORATION DBA TOSHIBA INTERNATIONAL CORP (USA)
SPECIFICATIONS
features_providedHIGH PERFORMANCE AND LOW POWER AND HIGH SPEED
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
memory_device_typeRAM
operating_temp_range-40.0 TO 85.0 CELSIUS DEGC
inclosure_configurationFLAT PACK
terminal_type_and_quantity100 FLAT LEADS
NSN5962-01-381-2383
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN TMPZ84C015BF-6 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
FEATURES PROVIDED: HIGH PERFORMANCE AND LOW POWER AND HIGH SPEED
•
INCLOSURE CONFIGURATION: FLAT PACK
•
MEMORY DEVICE TYPE: RAM
•
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
•
OPERATING TEMP RANGE: -40.0 TO 85.0 CELSIUS DEGC
•
TERMINAL TYPE AND QUANTITY: 100 FLAT LEADS
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
FEATURES PROVIDEDHIGH PERFORMANCE AND LOW POWER AND HIGH SPEED
INCLOSURE CONFIGURATIONFLAT PACK
MEMORY DEVICE TYPERAM
OUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
OPERATING TEMP RANGE-40.0 TO 85.0 CELSIUS DEGC
TERMINAL TYPE AND QUANTITY100 FLAT LEADS
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 1
TMPZ84C015-AF-6Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Demilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is TMPZ84C015BF-6?
TMPZ84C015BF-6 is a MICROCIRCUIT,MEMORY.
What parts can replace TMPZ84C015BF-6?
There is 1 known substitute for TMPZ84C015BF-6: TMPZ84C015-AF-6. Substitute compatibility should be verified for your specific system.
What is the NSN for TMPZ84C015BF-6?
TMPZ84C015BF-6 is cataloged in the U.S. Government catalog under NSN 5962-01-381-2383. This indicates validated use in U.S. government and defense supply chains.
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