Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: TMM2016AP-15

TMM2016AP-15 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.210 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, special_features: WEAPON SYSTEM ESSENTIAL, features_provided: HIGH SPEED AND LOW POWER AND HIGH PERFORMANCE AND HIGH RELIABILITY, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-175-8093, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

TMM2016AP-15

NSN: 5962-01-175-8093
FSC: 5962
CAGE: 61802 — TOSHIBA INTERNATIONAL CORPORATION DBA TOSHIBA INTERNATIONAL CORP (USA)

SPECIFICATIONS

body_width	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.210 INCHES MAXIMUM IN
body_length	1.290 INCHES MAXIMUM IN
special_features	WEAPON SYSTEM ESSENTIAL
features_provided	HIGH SPEED AND LOW POWER AND HIGH PERFORMANCE AND HIGH RELIABILITY
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	ROM
storage_temp_range	-55.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	22 INPUT
end_item_identification	WSD: SUPPORT EQUIPMENT, B-52 AIRCRAFT; BALLISTIC MISSILE EARLY WARNING SYS. (BMEWS); AIRCRAFT, EAGLE F-15
NSN	5962-01-175-8093

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 22 INPUT

•

FEATURES PROVIDED: HIGH SPEED AND LOW POWER AND HIGH PERFORMANCE AND HIGH RELIABILITY

•

TERMINAL SURFACE TREATMENT: SOLDER

•

TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT

•

TIME RATING PER CHACTERISTIC: 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

INPUT CIRCUIT PATTERN	22 INPUT
END ITEM IDENTIFICATION	WSD: SUPPORT EQUIPMENT, B-52 AIRCRAFT; BALLISTIC MISSILE EARLY WARNING SYS. (BMEWS); AIRCRAFT, EAGLE F-15
FEATURES PROVIDED	HIGH SPEED AND LOW POWER AND HIGH PERFORMANCE AND HIGH RELIABILITY
TERMINAL SURFACE TREATMENT	SOLDER
TERMINAL TYPE AND QUANTITY	24 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC	150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
SPECIAL FEATURES	WEAPON SYSTEM ESSENTIAL
MEMORY DEVICE TYPE	ROM
CRITICALITY CODE JUSTIFICATION	FEAT

VERIFIED SUBSTITUTES & CROSS-REFERENCES 14

IDS611LA150DBInterchangeable