TMM2016 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

TMM2016: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 14.2 MILLIMETERS MAXIMUM MM, body_length: 32.4 MILLIMETERS MAXIMUM MM, overall_height: 8.2 MILLIMETERS NOMINAL MM, features_provided: STATIC OPERATION AND EXPANDABLE AND HIGH PERFORMANCE AND HIGH RELIABILITY AND 3-STATE OUTPUT AND W/ENABLE, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: PLASTIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-199-6932, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

TMM2016

NSN: 5962-01-199-6932
FSC: 5962 — Microcircuits, Electronic
CAGE: 58900 — GIGA-TRONICS INCORPORATED DBA GIGA-TRONICS (USA)

SPECIFICATIONS

body_width	14.2 MILLIMETERS MAXIMUM MM
body_length	32.4 MILLIMETERS MAXIMUM MM
overall_height	8.2 MILLIMETERS NOMINAL MM
features_provided	STATIC OPERATION AND EXPANDABLE AND HIGH PERFORMANCE AND HIGH RELIABILITY AND 3-STATE OUTPUT AND W/ENABLE
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	RAM
storage_temp_range	-55.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	22 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-199-6932

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 22 INPUT

•

INCLOSURE MATERIAL: PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 14.2 MILLIMETERS MAXIMUM MM

•

FEATURES PROVIDED: STATIC OPERATION AND EXPANDABLE AND HIGH PERFORMANCE AND HIGH RELIABILITY AND 3-STATE OUTPUT AND W/ENABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

OVERALL HEIGHT	8.2 MILLIMETERS NOMINAL MM
INPUT CIRCUIT PATTERN	22 INPUT
INCLOSURE MATERIAL	PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	14.2 MILLIMETERS MAXIMUM MM
FEATURES PROVIDED	STATIC OPERATION AND EXPANDABLE AND HIGH PERFORMANCE AND HIGH RELIABILITY AND 3-STATE OUTPUT AND W/ENABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
BODY LENGTH	32.4 MILLIMETERS MAXIMUM MM
STORAGE TEMP RANGE	-55.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

UMN0-02128Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

M58725PReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is TMM2016?

TMM2016 is a MICROCIRCUIT,MEMORY.

What parts can replace TMM2016?

There are 2 known substitutes for TMM2016: UMN0-02128, M58725P. Substitute compatibility should be verified for your specific system.

What is the NSN for TMM2016?

TMM2016 is cataloged in the U.S. Government catalog under NSN 5962-01-199-6932. This indicates validated use in U.S. government and defense supply chains.

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