TIS150 — TRANSISTOR

✓ Government record, cited

— · SFP TRANSCEIVER

PRODUCT OVERVIEW

TIS150: TRANSISTOR.

The TRANSISTOR is a the manufacturer industrial component. Key specifications include material: PLASTIC ENCLOSURE, overall_width: 0.380 INCHES MINIMUM AND 0.420 INCHES MAXIMUM IN, overall_height: 0.140 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN, overall_length: 0.560 INCHES MINIMUM AND 0.650 INCHES MAXIMUM IN, mounting_method: UNTHREADED HOLE(S), special_features: JUNCTION PATTERN ARRANGEMENT: NPN. This part is cataloged in the U.S.

Government catalog under NSN 5961-01-141-5641, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

TIS150

NSN: 5961-01-141-5641
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 01295 — TEXAS INSTRUMENTS INCORPORATED (USA)

SPECIFICATIONS

material	PLASTIC ENCLOSURE
overall_width	0.380 INCHES MINIMUM AND 0.420 INCHES MAXIMUM IN
overall_height	0.140 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN
overall_length	0.560 INCHES MINIMUM AND 0.650 INCHES MAXIMUM IN
mounting_method	UNTHREADED HOLE(S)
special_features	JUNCTION PATTERN ARRANGEMENT: NPN
internal_configuration	JUNCTION CONTACT
semiconductor_material	SILICON
end_item_identification	C141FLTS1MREF 82932
mounting_facility_quantity	1
terminal_type_and_quantity	3 PIN
power_rating_per_characteristic	2.0 WATTS MAXIMUM TOTAL POWER DISSIPATION
NSN	5961-01-141-5641

COMPONENT DIAGRAM

KEY FEATURES

•

MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 150.0 CELSIUS JUNCTION DEGC

•

MOUNTING FACILITY QUANTITY: 1

•

JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION: T0-220B

•

MOUNTING METHOD: UNTHREADED HOLE(S)

•

SEMICONDUCTOR MATERIAL: SILICON

•

INTERNAL CONFIGURATION: JUNCTION CONTACT

TECHNICAL CHARACTERISTICS

OVERALL HEIGHT	0.140 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT	150.0 CELSIUS JUNCTION DEGC
MOUNTING FACILITY QUANTITY	1
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION	T0-220B
MOUNTING METHOD	UNTHREADED HOLE(S)
SEMICONDUCTOR MATERIAL	SILICON
OVERALL LENGTH	0.560 INCHES MINIMUM AND 0.650 INCHES MAXIMUM IN
INTERNAL CONFIGURATION	JUNCTION CONTACT
OVERALL WIDTH	0.380 INCHES MINIMUM AND 0.420 INCHES MAXIMUM IN
SPECIAL FEATURES	JUNCTION PATTERN ARRANGEMENT: NPN

OTHER ITEMS IN FSC 5961 — Semiconductor Devices and Associated Hardware

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5961-00-000-0150 5961-00-000-4541 5961-00-000-5400 5961-00-000-7614 5961-00-000-8760 5961-00-001-1352 5961-00-001-2624 5961-00-001-2978

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

No demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is TIS150?

TIS150 is a TRANSISTOR.

What is the NSN for TIS150?

TIS150 is cataloged in the U.S. Government catalog under NSN 5961-01-141-5641. This indicates validated use in U.S. government and defense supply chains.

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TIS150 — TRANSISTOR

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