TIBPAL16R4-30MWB — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

TIBPAL16R4-30MWB: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.540 INCHES MAXIMUM IN, overall_width: 0.745 INCHES MINIMUM AND 1.040 INCHES MAXIMUM IN, overall_length: 0.540 INCHES MAXIMUM IN, features_provided: BIPOLAR AND PROGRAMMABLE AND HIGH IMPEDANCE AND W/CLOCK AND BIDIRECTIONAL AND MONOLITHIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-351-7279, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

TIBPAL16R4-30MWB

NSN: 5962-01-351-7279
NIINs: 013517279, 013521007
FSC: 5962 — Microcircuits, Electronic
CAGE: 01295 — TEXAS INSTRUMENTS INCORPORATED (USA)

SPECIFICATIONS

body_width	0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
body_height	0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length	0.540 INCHES MAXIMUM IN
overall_width	0.745 INCHES MINIMUM AND 1.040 INCHES MAXIMUM IN
overall_length	0.540 INCHES MAXIMUM IN
features_provided	BIPOLAR AND PROGRAMMABLE AND HIGH IMPEDANCE AND W/CLOCK AND BIDIRECTIONAL AND MONOLITHIC
output_logic_form	BIPOLAR METAL-OXIDE SEMICONDUCTOR
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-351-7279

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 16 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN

•

FEATURES PROVIDED: BIPOLAR AND PROGRAMMABLE AND HIGH IMPEDANCE AND W/CLOCK AND BIDIRECTIONAL AND MONOLITHIC

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	16 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
BODY HEIGHT	0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
OVERALL LENGTH	0.540 INCHES MAXIMUM IN
OVERALL WIDTH	0.745 INCHES MINIMUM AND 1.040 INCHES MAXIMUM IN
FEATURES PROVIDED	BIPOLAR AND PROGRAMMABLE AND HIGH IMPEDANCE AND W/CLOCK AND BIDIRECTIONAL AND MONOLITHIC
INCLOSURE CONFIGURATION	FLAT PACK
CURRENT RATING PER CHARACTERISTIC	12.00 MILLIAMPERES MAXIMUM OUTPUT

SUBSTITUTES & CROSS-REFERENCES 6

5962-8515509SBReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-85155Reference document

Same NSN cross-reference

Reference document — Identification reference

5962-8515509SXReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8515509SASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

PAL16R4B-2MW/883BReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is TIBPAL16R4-30MWB?

TIBPAL16R4-30MWB is a MICROCIRCUIT,DIGITAL.

What parts can replace TIBPAL16R4-30MWB?

There are 6 known substitutes for TIBPAL16R4-30MWB: 5962-8515509SB, 5962-85155, 5962-8515509SX and 3 more. Substitute compatibility should be verified for your specific system.

What is the NSN for TIBPAL16R4-30MWB?

TIBPAL16R4-30MWB is cataloged in the U.S. Government catalog under NSN 5962-01-351-7279. This indicates validated use in U.S. government and defense supply chains.

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