TIBPAL16R4-15MJB — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

TIBPAL16R4-15MJB: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN, body_height: 0.210 INCHES MAXIMUM IN, body_length: 0.925 INCHES MINIMUM AND 1.060 INCHES MAXIMUM IN, overall_height: 0.400 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-303-8885, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

TIBPAL16R4-15MJB

NSN: 5962-01-303-8885
NIINs: 013038885, 013260640
FSC: 5962 — Microcircuits, Electronic
CAGE: 01295 — TEXAS INSTRUMENTS INCORPORATED (USA)

SPECIFICATIONS

body_width	0.240 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN
body_height	0.210 INCHES MAXIMUM IN
body_length	0.925 INCHES MINIMUM AND 1.060 INCHES MAXIMUM IN
overall_height	0.400 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND 3-STATE OUTPUT
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-303-8885

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 ARRAY, LOGIC

•

BODY WIDTH: 0.240 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.210 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND 3-STATE OUTPUT

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 ARRAY, LOGIC
BODY WIDTH	0.240 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN
BODY HEIGHT	0.210 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND 3-STATE OUTPUT
INCLOSURE CONFIGURATION	DUAL-IN-LINE
BODY LENGTH	0.925 INCHES MINIMUM AND 1.060 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

9931-BGHFSame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is TIBPAL16R4-15MJB?

TIBPAL16R4-15MJB is a MICROCIRCUIT,DIGITAL.

What parts can replace TIBPAL16R4-15MJB?

There are 2 known substitutes for TIBPAL16R4-15MJB: ROM/PROM, 9931-BGHF. Substitute compatibility should be verified for your specific system.

What is the NSN for TIBPAL16R4-15MJB?

TIBPAL16R4-15MJB is cataloged in the U.S. Government catalog under NSN 5962-01-303-8885. This indicates validated use in U.S. government and defense supply chains.

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