The ADHESIVE is a the manufacturer industrial component. Key specifications include color: GREEN, material: PLASTIC EPOXY, physical_form: PASTE, special_features: THERMALLY CONDUCTIVE, features_provided: SEPARATE CATALYST, specific_usage_design: FOR BONDING SEMICONDUCTORS AND OTHER ELECTRONIC COMPONENTS TO CHASSIS OR HEAT SINKS. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 8040-01-162-5593, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| color | GREEN |
| material | PLASTIC EPOXY |
| physical_form | PASTE |
| special_features | THERMALLY CONDUCTIVE |
| features_provided | SEPARATE CATALYST |
| specific_usage_design | FOR BONDING SEMICONDUCTORS AND OTHER ELECTRONIC COMPONENTS TO CHASSIS OR HEAT SINKS |
| supplementary_features | 100 GRAM KIT G |
| quantity_within_each_unit_package | 100.000 GRAMS G |
| NSN | 8040-01-162-5593 |
| PHYSICAL FORM | PASTE |
| SUPPLEMENTARY FEATURES | 100 GRAM KIT G |
| QUANTITY WITHIN EACH UNIT PACKAGE | 100.000 GRAMS G |
| MATERIAL | PLASTIC EPOXY |
| SPECIAL FEATURES | THERMALLY CONDUCTIVE |
| FEATURES PROVIDED | SEPARATE CATALYST |
| COLOR | GREEN |
| SPECIFIC USAGE DESIGN | FOR BONDING SEMICONDUCTORS AND OTHER ELECTRONIC COMPONENTS TO CHASSIS OR HEAT SINKS |