TC5564APL-15: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 142.0 MILLIMETERS MAXIMUM MM, body_height: 469.0 MILLIMETERS MAXIMUM MM, body_length: 380.0 MILLIMETERS MAXIMUM MM, bit_quantity: 65536, word_quantity: 8192, features_provided: BURN IN AND LOW POWER AND STATIC OPERATION. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-310-2181, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 142.0 MILLIMETERS MAXIMUM MM |
| body_height | 469.0 MILLIMETERS MAXIMUM MM |
| body_length | 380.0 MILLIMETERS MAXIMUM MM |
| bit_quantity | 65536 |
| word_quantity | 8192 |
| features_provided | BURN IN AND LOW POWER AND STATIC OPERATION |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -55.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -40.0 TO 85.0 CELSIUS DEGC |
| input_circuit_pattern | 26 INPUT |
| NSN | 5962-01-310-2181 |
| BIT QUANTITY | 65536 |
| INPUT CIRCUIT PATTERN | 26 INPUT |
| WORD QUANTITY | 8192 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 142.0 MILLIMETERS MAXIMUM MM |
| BODY HEIGHT | 469.0 MILLIMETERS MAXIMUM MM |
| FEATURES PROVIDED | BURN IN AND LOW POWER AND STATIC OPERATION |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | ROM |
No substitute or cross-reference records for this part.