TC5564AFL-15 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

TC5564AFL-15: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 9.0 MILLIMETERS MAXIMUM MM, body_height: 51.8 MILLIMETERS MAXIMUM MM, body_length: 38.0 MILLIMETERS MAXIMUM MM, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: PLASTIC, memory_device_type: RAM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-386-0502, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

TC5564AFL-15

NSN: 5962-01-386-0502
FSC: 5962 — Microcircuits, Electronic
CAGE: 61802 — TOSHIBA INTERNATIONAL CORPORATION DBA TOSHIBA INTERNATIONAL CORP (USA)

SPECIFICATIONS

body_width	9.0 MILLIMETERS MAXIMUM MM
body_height	51.8 MILLIMETERS MAXIMUM MM
body_length	38.0 MILLIMETERS MAXIMUM MM
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	RAM
operating_temp_range	-40.0 TO 85.0 CELSIUS DEGC
input_circuit_pattern	25 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
voltage_rating_and_type_per_characteristic	5.0 VOLTS MAXIMUM TOTAL SUPPLY
NSN	5962-01-386-0502

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 25 INPUT

•

INCLOSURE MATERIAL: PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 9.0 MILLIMETERS MAXIMUM MM

•

BODY HEIGHT: 51.8 MILLIMETERS MAXIMUM MM

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: RAM

•

BODY LENGTH: 38.0 MILLIMETERS MAXIMUM MM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	25 INPUT
INCLOSURE MATERIAL	PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	9.0 MILLIMETERS MAXIMUM MM
BODY HEIGHT	51.8 MILLIMETERS MAXIMUM MM
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
BODY LENGTH	38.0 MILLIMETERS MAXIMUM MM
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	5.0 VOLTS MAXIMUM TOTAL SUPPLY

SUBSTITUTES & CROSS-REFERENCES 3

352250300277Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

10312387Reference document

Same NSN cross-reference

Reference document — Informative reference only

HM6264LFP-15Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is TC5564AFL-15?

TC5564AFL-15 is a MICROCIRCUIT,MEMORY.

What parts can replace TC5564AFL-15?

There are 3 known substitutes for TC5564AFL-15: 352250300277, 10312387, HM6264LFP-15. Substitute compatibility should be verified for your specific system.

What is the NSN for TC5564AFL-15?

TC5564AFL-15 is cataloged in the U.S. Government catalog under NSN 5962-01-386-0502. This indicates validated use in U.S. government and defense supply chains.

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