TBP28LA22MJ/B — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

TBP28LA22MJ/B: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.130 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN, body_length: 0.955 INCHES MINIMUM AND 1.010 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND PROGRAMMED AND W/ENABLE AND W/OPEN COLLECTOR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-130-8657, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

TBP28LA22MJ/B

NSN: 5962-01-130-8657
FSC: 5962 — Microcircuits, Electronic
CAGE: 3V146 — ROCHESTER ELECTRONICS LLC (USA)

SPECIFICATIONS

body_width	0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
body_height	0.130 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN
body_length	0.955 INCHES MINIMUM AND 1.010 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND PROGRAMMED AND W/ENABLE AND W/OPEN COLLECTOR
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
end_item_identification	DATA LINK 76301
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-130-8657

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.130 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND PROGRAMMED AND W/ENABLE AND W/OPEN COLLECTOR

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
BODY HEIGHT	0.130 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND PROGRAMMED AND W/ENABLE AND W/OPEN COLLECTOR
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PROM
BODY LENGTH	0.955 INCHES MINIMUM AND 1.010 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

5308-1J/883BReference document

Same NSN cross-reference

Reference document — Secondary reference

53S280J883BReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is TBP28LA22MJ/B?

TBP28LA22MJ/B is a MICROCIRCUIT,MEMORY.

What parts can replace TBP28LA22MJ/B?

There are 3 known substitutes for TBP28LA22MJ/B: 5308-1J/883B, 53S280J883B, ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for TBP28LA22MJ/B?

TBP28LA22MJ/B is cataloged in the U.S. Government catalog under NSN 5962-01-130-8657. This indicates validated use in U.S. government and defense supply chains.

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