TBP18SA030N — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

TBP18SA030N: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.180 INCHES NOMINAL IN, body_length: 0.870 INCHES MAXIMUM IN, bit_quantity: 256, word_quantity: 32, memory_capacity: UNKNOWN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-026-2459, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

TBP18SA030N

NSN: 5962-01-026-2459
NIINs: 010262459, 010266045, 010584864, 011046414, 011414360, 011653130, 011700600, 011706790, 011839559
FSC: 5962 — Microcircuits, Electronic
CAGE: 01295 — TEXAS INSTRUMENTS INCORPORATED (USA)

SPECIFICATIONS

body_width	0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
body_height	0.180 INCHES NOMINAL IN
body_length	0.870 INCHES MAXIMUM IN
bit_quantity	256
word_quantity	32
memory_capacity	UNKNOWN
special_features	WEAPON SYSTEM ESSENTIAL
features_provided	3-STATE OUTPUT AND W/OPEN COLLECTOR AND PROGRAMMABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
NSN	5962-01-026-2459

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 6 INPUT

•

INCLOSURE MATERIAL: PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.250 INCHES NOMINAL IN

•

BODY HEIGHT: 0.180 INCHES MAXIMUM IN

•

CRITICALITY CODE JUSTIFICATION: FEAT

•

FEATURES PROVIDED: PROGRAMMABLE AND HIGH SPEED AND EXPANDABLE AND W/OPEN COLLECTOR AND W/ENABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	6 INPUT
INCLOSURE MATERIAL	PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.250 INCHES NOMINAL IN
BODY HEIGHT	0.180 INCHES MAXIMUM IN
CRITICALITY CODE JUSTIFICATION	FEAT
FEATURES PROVIDED	PROGRAMMABLE AND HIGH SPEED AND EXPANDABLE AND W/OPEN COLLECTOR AND W/ENABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.870 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 3

1816-0004Reference document

Same NSN cross-reference

Reference document — Secondary reference

SN74S188NReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROM FAMILY 022Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is TBP18SA030N?

TBP18SA030N is a MICROCIRCUIT,MEMORY.

What parts can replace TBP18SA030N?

There are 3 known substitutes for TBP18SA030N: 1816-0004, SN74S188N, ROM/PROM FAMILY 022. Substitute compatibility should be verified for your specific system.

What is the NSN for TBP18SA030N?

TBP18SA030N is cataloged in the U.S. Government catalog under NSN 5962-01-026-2459. This indicates validated use in U.S. government and defense supply chains.

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