The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.055 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN, body_length: 0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, features_provided: POSITIVE OUTPUTS AND MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System under NSN 5962-00-214-3313, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| body_height | 0.055 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN |
| body_length | 0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| features_provided | POSITIVE OUTPUTS AND MONOLITHIC |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 4 STAGE |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| time_rating_per_chacteristic | 650.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 650.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| NSN | 5962-00-214-3313 |
| TERMINAL SURFACE TREATMENT | SOLDER |
| FEATURES PROVIDED | POSITIVE OUTPUTS AND MONOLITHIC |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CASE OUTLINE SOURCE AND DESIGNATOR | -0-001-AE JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| BODY LENGTH | 0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| MAXIMUM POWER DISSIPATION RATING | 200.0 MILLIWATTS |