The SEMICONDUCTOR DEVICE,THYRISTOR is a the manufacturer industrial component. Key specifications include overall_length: 0.340 INCHES MAXIMUM IN, mounting_method: UNTHREADED HOLE(S), overall_diameter: 0.620 INCHES MAXIMUM IN, special_features: JUNCTION PATTERN ARRANGEMENT: PNPN, features_provided: HERMETICALLY SEALED CASE, internal_configuration: JUNCTION CONTACT. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-465-8359, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| overall_length | 0.340 INCHES MAXIMUM IN |
| mounting_method | UNTHREADED HOLE(S) |
| overall_diameter | 0.620 INCHES MAXIMUM IN |
| special_features | JUNCTION PATTERN ARRANGEMENT: PNPN |
| features_provided | HERMETICALLY SEALED CASE |
| internal_configuration | JUNCTION CONTACT |
| semiconductor_material | SILICON |
| mounting_facility_quantity | 2 |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD AND 1 CASE |
| current_rating_per_characteristic | 15.00 AMPERES MAXIMUM FORWARD CURRENT, DC |
| voltage_rating_in_volts_per_characteristic | 400.0 MAXIMUM BREAKOVER VOLTAGE, DC |
| maximum_operating_temp_per_measurement_point | 100.0 CELSIUS JUNCTION DEGC |
| NSN | 5961-00-465-8359 |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD AND 1 CASE |
| MOUNTING FACILITY QUANTITY | 2 |
| SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: PNPN |
| CURRENT RATING PER CHARACTERISTIC | 15.00 AMPERES MAXIMUM FORWARD CURRENT, DC |
| INTERNAL CONFIGURATION | JUNCTION CONTACT |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 100.0 CELSIUS JUNCTION DEGC |
| SEMICONDUCTOR MATERIAL | SILICON |
| ELECTRODE INTERNALLY-ELECTRICALLY CONNECTED TO CASE | COLLECTOR |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| OVERALL DIAMETER | 0.620 INCHES MAXIMUM IN |