The SEMICONDUCTOR DEVICES,UNITIZED is a the manufacturer industrial component. Key specifications include material: CERAMIC ENCLOSURE, overall_length: 0.150 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.500 INCHES MINIMUM IN, overall_diameter: 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN, special_features: ALL TRANSISTOR JUNCTION PATTERN ARRANGEMENT: NPN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-435-3678, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | CERAMIC ENCLOSURE |
| overall_length | 0.150 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.500 INCHES MINIMUM IN |
| overall_diameter | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN |
| special_features | ALL TRANSISTOR JUNCTION PATTERN ARRANGEMENT: NPN |
| features_provided | HERMETICALLY SEALED CASE |
| semiconductor_material | SILICON ALL TRANSISTOR |
| terminal_circle_diameter | 0.200 INCHES NOMINAL IN |
| terminal_type_and_quantity | 6 UNINSULATED WIRE LEAD |
| component_name_and_quantity | 2 TRANSISTOR |
| power_rating_per_characteristic | 400.0 MILLIWATTS MINIMUM TOTAL POWER DISSIPATION ALL SEMICONDUCTOR |
| NSN | 5961-00-435-3678 |
| MOUNTING METHOD | TERMINAL |
| JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-77 |
| TERMINAL LENGTH | 1.500 INCHES MINIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| TERMINAL CIRCLE DIAMETER | 0.200 INCHES NOMINAL IN |
| COMPONENT NAME AND QUANTITY | 2 TRANSISTOR |
| OVERALL DIAMETER | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN |
| SPECIAL FEATURES | ALL TRANSISTOR JUNCTION PATTERN ARRANGEMENT: NPN |
| MATERIAL | CERAMIC ENCLOSURE |
| POWER RATING PER CHARACTERISTIC | 400.0 MILLIWATTS MINIMUM TOTAL POWER DISSIPATION ALL SEMICONDUCTOR |