The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: STEEL COMP 303, end_similarity: IDENTICAL, overall_length: 1.865 INCHES MINIMUM AND 1.885 INCHES MAXIMUM IN, surface_finish: 10.0 MICROINCHES, first_end_style: PLAIN, inside_diameter: 2.500 INCHES NOMINAL IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-249-1636, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | STEEL COMP 303 |
| end_similarity | IDENTICAL |
| overall_length | 1.865 INCHES MINIMUM AND 1.885 INCHES MAXIMUM IN |
| surface_finish | 10.0 MICROINCHES |
| first_end_style | PLAIN |
| inside_diameter | 2.500 INCHES NOMINAL IN |
| mounting_method | TERMINAL |
| terminal_length | 0.700 INCHES MINIMUM IN |
| overall_diameter | 0.128 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| first_end_diameter | 0.2495 INCHES MINIMUM AND 0.2497 INCHES MAXIMUM IN |
| inside_surface_condition | SMOOTH |
| NSN | 5961-00-249-1636 |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 400.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| CURRENT RATING PER CHARACTERISTIC | 2.00 AMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| MATERIAL | SILICON SEMICONDUCTOR |
| MOUNTING METHOD | TERMINAL |
| TERMINAL LENGTH | 0.700 INCHES MINIMUM IN |
| OVERALL DIAMETER | 0.128 INCHES MAXIMUM IN |
| OVERALL LENGTH | 0.250 INCHES MAXIMUM IN |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| MATERIAL | GLASS ENCLOSURE |