The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.450 INCHES MAXIMUM IN, mounting_method: THREADED STUD(S), features_provided: HERMETICALLY SEALED CASE, nominal_thread_size: 0.250 INCHES IN, thread_series_designator: UNF. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-915-5460, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.450 INCHES MAXIMUM IN |
| mounting_method | THREADED STUD(S) |
| features_provided | HERMETICALLY SEALED CASE |
| nominal_thread_size | 0.250 INCHES IN |
| thread_series_designator | UNF |
| mounting_facility_quantity | 1 |
| overall_width_across_flats | 0.667 INCHES MINIMUM AND 0.687 INCHES MAXIMUM IN |
| terminal_type_and_quantity | 1 THREADED STUD AND 1 TAB, SOLDER LUG |
| current_rating_per_characteristic | 45.00 AMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE |
| voltage_rating_in_volts_per_characteristic | 100.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| maximum_operating_temp_per_measurement_point | 190.0 CELSIUS JUNCTION DEGC |
| NSN | 5961-00-915-5460 |
| MATERIAL | GLASS ENCLOSURE |
| THREAD SERIES DESIGNATOR | UNF |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 190.0 CELSIUS JUNCTION DEGC |
| OVERALL LENGTH | 0.450 INCHES MAXIMUM IN |
| TERMINAL TYPE AND QUANTITY | 1 THREADED STUD AND 1 TAB, SOLDER LUG |
| MOUNTING METHOD | THREADED STUD(S) |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| CURRENT RATING PER CHARACTERISTIC | 45.00 AMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE |
| NOMINAL THREAD SIZE | 0.250 INCHES IN |
| MOUNTING FACILITY QUANTITY | 1 |