SP1690MBDG: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.200 INCHES MAXIMUM IN, body_length: 0.740 INCHES MINIMUM AND 0.870 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND HIGH SPEED AND BURN IN, output_logic_form: EMITTER-COUPLED LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-122-7629, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.200 INCHES MAXIMUM IN |
| body_length | 0.740 INCHES MINIMUM AND 0.870 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND HIGH SPEED AND BURN IN |
| output_logic_form | EMITTER-COUPLED LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -30.0 TO 85.0 CELSIUS DEGC |
| input_circuit_pattern | DUAL 2 INPUT |
| end_item_identification | F16AIRCOMBFIT 81755 |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-122-7629 |
| INPUT CIRCUIT PATTERN | DUAL 2 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 2 FLIP-FLOP, D-TYPE, MASTER SLAVE |
| BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.200 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND HIGH SPEED AND BURN IN |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY LENGTH | 0.740 INCHES MINIMUM AND 0.870 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |