The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.300 INCHES MAXIMUM IN, body_height: 0.100 INCHES MAXIMUM IN, body_length: 0.350 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-168-7582, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.300 INCHES MAXIMUM IN |
| body_height | 0.100 INCHES MAXIMUM IN |
| body_length | 0.350 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND 3-STATE OUTPUT |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| operating_temp_range | +0.0 TO 70.0 CELSIUS DEGC |
| input_circuit_pattern | QUAD 2 INPUT |
| inclosure_configuration | FLAT PACK |
| design_function_and_quantity | 4 GATE, BUS BUFFER |
| NSN | 5962-01-168-7582 |
| BODY LENGTH | 0.350 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.100 INCHES MAXIMUM IN |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| BODY WIDTH | 0.300 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND 3-STATE OUTPUT |
| DESIGN FUNCTION AND QUANTITY | 4 GATE, BUS BUFFER |
| INCLOSURE CONFIGURATION | FLAT PACK |
| INPUT CIRCUIT PATTERN | QUAD 2 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| OPERATING TEMP RANGE | +0.0 TO 70.0 CELSIUS DEGC |