The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.260 INCHES NOMINAL IN, body_height: 0.070 INCHES MAXIMUM IN, body_length: 0.385 INCHES NOMINAL IN, special_features: FORMED LEADS, features_provided: HERMETICALLY SEALED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-528-9985, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.260 INCHES NOMINAL IN |
| body_height | 0.070 INCHES MAXIMUM IN |
| body_length | 0.385 INCHES NOMINAL IN |
| special_features | FORMED LEADS |
| features_provided | HERMETICALLY SEALED |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | TRIPLE 3 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-00-528-9985 |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| SPECIAL FEATURES | FORMED LEADS |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| INCLOSURE CONFIGURATION | FLAT PACK |
| BODY WIDTH | 0.260 INCHES NOMINAL IN |
| FEATURES PROVIDED | HERMETICALLY SEALED |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| INPUT CIRCUIT PATTERN | TRIPLE 3 INPUT |