The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 0.796 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND SCHOTTKY AND POSITIVE OUTPUTS AND W/TOTEM POLE OUTPUT AND HIGH SPEED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-632-8291, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| body_length | 0.796 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND MONOLITHIC AND SCHOTTKY AND POSITIVE OUTPUTS AND W/TOTEM POLE OUTPUT AND HIGH SPEED |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | DUAL 2 WIDE 2 INPUT |
| end_item_identification | SATELLITE TRACKING SET TYPE AN/GKC-1(V) |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-00-632-8291 |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| INPUT CIRCUIT PATTERN | DUAL 2 WIDE 2 INPUT |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND HIGH SPEED AND SCHOTTKY AND W/TOTEM POLE OUTPUT |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |
| MAXIMUM POWER DISSIPATION RATING | 121.0 MILLIWATTS |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 2 GATE, AND-OR INVERT |