The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.271 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND W/INHIBIT AND POSITIVE OUTPUTS, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-085-4178, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.245 INCHES MINIMUM AND 0.271 INCHES MAXIMUM IN |
| body_height | 0.185 INCHES MAXIMUM IN |
| body_length | 0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND W/INHIBIT AND POSITIVE OUTPUTS |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | +0.0 TO 75.0 CELSIUS DEGC |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| design_function_and_quantity | 3 DRIVER, LINE |
| maximum_power_dissipation_rating | 630.0 MILLIWATTS |
| case_outline_source_and_designator | TO-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| NSN | 5962-01-085-4178 |
| MAXIMUM POWER DISSIPATION RATING | 630.0 MILLIWATTS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.245 INCHES MINIMUM AND 0.271 INCHES MAXIMUM IN |
| BODY LENGTH | 0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| INCLOSURE MATERIAL | CERAMIC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OPERATING TEMP RANGE | +0.0 TO 75.0 CELSIUS DEGC |
| BODY HEIGHT | 0.185 INCHES MAXIMUM IN |
| DESIGN FUNCTION AND QUANTITY | 3 DRIVER, LINE |