The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 0.710 INCHES MINIMUM AND 0.770 INCHES MAXIMUM IN, features_provided: MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: PLASTIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-102-7519, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| body_height | 0.180 INCHES MAXIMUM IN |
| body_length | 0.710 INCHES MINIMUM AND 0.770 INCHES MAXIMUM IN |
| features_provided | MONOLITHIC |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | PLASTIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -0.0 TO 70.0 CELSIUS DEGC |
| input_circuit_pattern | 6 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-00-102-7519 |
| INCLOSURE MATERIAL | PLASTIC |
| OPERATING TEMP RANGE | +0.0 TO 70.0 CELSIUS DEGC |
| CASE OUTLINE SOURCE AND DESIGNATOR | T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| TIME RATING PER CHACTERISTIC | 48.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN |
| MAXIMUM POWER DISSIPATION RATING | 145.0 MILLIWATTS |
| INPUT CIRCUIT PATTERN | 6 INPUT |
| BODY WIDTH | 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN |
| BODY LENGTH | 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |