SN57401J/883B — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

SN57401J/883B: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, overall_width: 0.320 INCHES MAXIMUM IN, overall_height: 0.400 INCHES MAXIMUM IN, overall_length: 0.840 INCHES MAXIMUM IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-105-1323, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

SN57401J/883B

NSN: 5962-01-105-1323
NIINs: 011051323, 012907020
FSC: 5962 — Microcircuits, Electronic
CAGE: 50364 — MMI/AMD (USA)

SPECIFICATIONS

body_width	0.310 INCHES MAXIMUM IN
body_height	0.140 INCHES MAXIMUM IN
body_length	0.840 INCHES MAXIMUM IN
overall_width	0.320 INCHES MAXIMUM IN
overall_height	0.400 INCHES MAXIMUM IN
overall_length	0.840 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	ELECTROSTATIC SENSITIVE AND MONOLITHIC
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	FIRST-IN FIRST-OUT
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
NSN	5962-01-105-1323

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 7 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.110 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND PROGRAMMABLE AND PROGRAMMED AND RESETTABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: FIRST-IN FIRST-OUT

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	7 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.110 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND PROGRAMMABLE AND PROGRAMMED AND RESETTABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	FIRST-IN FIRST-OUT
BODY LENGTH	0.740 INCHES MINIMUM AND 0.810 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 8

839190-0014Reference document

Same NSN cross-reference

Reference document — Secondary reference

57401D/883BReference document

Same NSN cross-reference

Reference document — Secondary reference

SM-A-989345Reference document

Same NSN cross-reference

Reference document — Vendor item drawing reference

10172-002Reference document

Same NSN cross-reference

Reference document — Secondary reference

7849578P001Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

67401JReference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

LIFECYCLE

NSN statusCancelled· U.S. Government catalog

Demilitarization required — mutilation

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FREQUENTLY ASKED QUESTIONS

What is SN57401J/883B?

SN57401J/883B is a MICROCIRCUIT,MEMORY.

What parts can replace SN57401J/883B?

There are 8 known substitutes for SN57401J/883B: 839190-0014, 57401D/883B, SM-A-989345 and 5 more. Substitute compatibility should be verified for your specific system.

What is the NSN for SN57401J/883B?

SN57401J/883B is cataloged in the U.S. Government catalog under NSN 5962-01-105-1323. This indicates validated use in U.S. government and defense supply chains.

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SN57401J/883B — MICROCIRCUIT,MEMORY

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