SN54H73S06: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.120 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN, body_length: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND HIGH SPEED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: GLASS, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-032-7646, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.120 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN |
| body_length | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND HIGH SPEED |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | GLASS |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | FLAT PACK |
| design_function_and_quantity | 2 FLIP-FLOP, J-K, MASTER SLAVE |
| case_outline_source_and_designator | T0-84 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| NSN | 5962-01-032-7646 |
| INCLOSURE MATERIAL | GLASS |
| DESIGN FUNCTION AND QUANTITY | 2 FLIP-FLOP, J-K, MASTER SLAVE |
| BODY WIDTH | 0.120 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND HIGH SPEED |
| INCLOSURE CONFIGURATION | FLAT PACK |
| CASE OUTLINE SOURCE AND DESIGNATOR | T0-84 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| BODY LENGTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |