The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.280 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 0.785 INCHES MAXIMUM IN, special_features: BENT LEADS, features_provided: MONOLITHIC AND HERMETICALLY SEALED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-172-8520, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.280 INCHES MAXIMUM IN |
| body_height | 0.180 INCHES MAXIMUM IN |
| body_length | 0.785 INCHES MAXIMUM IN |
| special_features | BENT LEADS |
| features_provided | MONOLITHIC AND HERMETICALLY SEALED |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | SILICON |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | DUAL 4 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 14 PRINTED CIRCUIT |
| NSN | 5962-00-172-8520 |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| BODY WIDTH | 0.280 INCHES MAXIMUM IN |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| INCLOSURE MATERIAL | SILICON |
| TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| SPECIAL FEATURES | BENT LEADS |
| FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED |
| DESIGN FUNCTION AND QUANTITY | 1 BUFFER, NAND |
| BODY HEIGHT | 0.180 INCHES MAXIMUM IN |