SMP11BRC/883C — MICROCIRCUIT,LINEAR

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

SMP11BRC/883C: MICROCIRCUIT,LINEAR.

The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 0.358 INCHES MAXIMUM IN, body_height: 0.100 INCHES MAXIMUM IN, body_length: 0.358 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND W/SAMPLE AND HOLD, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-274-4204, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

SMP11BRC/883C

NSN: 5962-01-274-4204
FSC: 5962 — Microcircuits, Electronic
CAGE: 24355 — ANALOG DEVICES, INC. DIV CORPORATE HEADQUARTERS (USA)

SPECIFICATIONS

body_width	0.358 INCHES MAXIMUM IN
body_height	0.100 INCHES MAXIMUM IN
body_length	0.358 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND W/SAMPLE AND HOLD
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	4 INPUT
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	20 LEADLESS
NSN	5962-01-274-4204

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 4 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 AMPLIFIER, SAMPLE/HOLD

•

BODY WIDTH: 0.358 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.100 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND W/SAMPLE AND HOLD

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	4 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 AMPLIFIER, SAMPLE/HOLD
BODY WIDTH	0.358 INCHES MAXIMUM IN
BODY HEIGHT	0.100 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND W/SAMPLE AND HOLD
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
BODY LENGTH	0.358 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

10133588Reference document

Same NSN cross-reference

Reference document — Informative reference only

SMP-11BRC/883Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

Ready to buy SMP11BRC/883C?

Compare prices from verified sellers on eBay

Buy on eBay →

As an eBay Partner, PartsTable may earn a commission. Your price is not affected.

FREQUENTLY ASKED QUESTIONS

What is SMP11BRC/883C?

SMP11BRC/883C is a MICROCIRCUIT,LINEAR.

What parts can replace SMP11BRC/883C?

There are 2 known substitutes for SMP11BRC/883C: 10133588, SMP-11BRC/883. Substitute compatibility should be verified for your specific system.

What is the NSN for SMP11BRC/883C?

SMP11BRC/883C is cataloged in the U.S. Government catalog under NSN 5962-01-274-4204. This indicates validated use in U.S. government and defense supply chains.

Community Feedback

SMP11BRC/883C — MICROCIRCUIT,LINEAR

Request a Quote — SMP11BRC/883C