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Technical Data Sheet

SMP11AY/883C — MICROCIRCUIT,LINEAR

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

SMP11AY/883C: MICROCIRCUIT,LINEAR.

The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN, body_height: 0.185 INCHES NOMINAL IN, body_length: 0.785 INCHES MAXIMUM IN, special_features: WEAPON SYSTEM ESSENTIAL, features_provided: HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE AND HIGH SLEW RATE, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-166-3002, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
SMP11AY/883C
NSN: 5962-01-166-3002
FSC: 5962 — Microcircuits, Electronic
CAGE: 06665 — ANALOG DEVICES, INC. DIV SANTA CLARA SITE (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN
body_height0.185 INCHES NOMINAL IN
body_length0.785 INCHES MAXIMUM IN
special_featuresWEAPON SYSTEM ESSENTIAL
features_providedHERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE AND HIGH SLEW RATE
inclosure_materialCERAMIC
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern4 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
design_function_and_quantity1 AMPLIFIER, SAMPLE/HOLD
NSN5962-01-166-3002
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,LINEAR TITLE COMPONENT PN SMP11AY/883C MFR MICROCIRCUIT,LINEAR
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 4 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
DESIGN FUNCTION AND QUANTITY: 1 AMPLIFIER, SAMPLE/HOLD
•
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.185 INCHES NOMINAL IN
•
CRITICALITY CODE JUSTIFICATION: FEAT
•
FEATURES PROVIDED: HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE AND HIGH SLEW RATE
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN4 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
DESIGN FUNCTION AND QUANTITY1 AMPLIFIER, SAMPLE/HOLD
BODY WIDTH0.220 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN
BODY HEIGHT0.185 INCHES NOMINAL IN
CRITICALITY CODE JUSTIFICATIONFEAT
FEATURES PROVIDEDHERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE AND HIGH SLEW RATE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
BODY LENGTH0.785 INCHES MAXIMUM IN
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 5
53444601AReference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
1826-0988Reference document
Same NSN cross-reference
Reference document — Secondary reference
SMP11AY/883BReference document
Same NSN cross-reference
Reference document — Secondary reference
SMP11AY/883Reference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
SMP11GYReference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is SMP11AY/883C?
SMP11AY/883C is a MICROCIRCUIT,LINEAR.
What parts can replace SMP11AY/883C?
There are 5 known substitutes for SMP11AY/883C: 53444601A, 1826-0988, SMP11AY/883B and 2 more. Substitute compatibility should be verified for your specific system.
What is the NSN for SMP11AY/883C?
SMP11AY/883C is cataloged in the U.S. Government catalog under NSN 5962-01-166-3002. This indicates validated use in U.S. government and defense supply chains.
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