Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: SMC659919-2

SMC659919-2 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.525 INCHES MINIMUM AND 0.545 INCHES MAXIMUM IN, body_height: 0.110 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN, body_length: 1.270 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, output_logic_form: P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-024-9512, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

SMC659919-2

NSN: 5962-00-024-9512
FSC: 5962
CAGE: 80063 — US ARMY COMMUNICATIONS & ELECTRONICS MATERIEL READINESS COMMAND LOGISTICS ENGINEERING DIR (USA)

SPECIFICATIONS

body_width	0.525 INCHES MINIMUM AND 0.545 INCHES MAXIMUM IN
body_height	0.110 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN
body_length	1.270 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND W/ENABLE AND PROGRAMMABLE AND PROGRAMMED AND W/DISABLE AND W/DECODED OUTPUT
output_logic_form	P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	11 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-00-024-9512

COMPONENT DIAGRAM

KEY FEATURES

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OUTPUT LOGIC FORM: P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC

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INPUT CIRCUIT PATTERN: 11 INPUT

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TEST DATA DOCUMENT: 80063-SM-C-659919 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)

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MEMORY CAPACITY: UNKNOWN

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TERMINAL SURFACE TREATMENT: SOLDER

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MEMORY DEVICE TYPE: ROM

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -30.0 VOLTS MINIMUM POWER SOURCE AND 0.3 VOLTS MAXIMUM POWER SOURCE

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TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

OUTPUT LOGIC FORM	P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
INPUT CIRCUIT PATTERN	11 INPUT
TEST DATA DOCUMENT	80063-SM-C-659919 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)
MEMORY CAPACITY	UNKNOWN
TERMINAL SURFACE TREATMENT	SOLDER
MEMORY DEVICE TYPE	ROM
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-30.0 VOLTS MINIMUM POWER SOURCE AND 0.3 VOLTS MAXIMUM POWER SOURCE
TERMINAL TYPE AND QUANTITY	24 PRINTED CIRCUIT
INCLOSURE CONFIGURATION	DUAL-IN-LINE
INCLOSURE MATERIAL	CERAMIC AND GLASS

VERIFIED SUBSTITUTES & CROSS-REFERENCES 7

A-A-51130 TYI ST 1 GRA CL M-2Interchangeable