The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.330 INCHES NOMINAL IN, body_height: 0.310 INCHES NOMINAL IN, body_length: 0.790 INCHES NOMINAL IN, features_provided: BURN IN AND HERMETICALLY SEALED AND MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-219-0992, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.330 INCHES NOMINAL IN |
| body_height | 0.310 INCHES NOMINAL IN |
| body_length | 0.790 INCHES NOMINAL IN |
| features_provided | BURN IN AND HERMETICALLY SEALED AND MONOLITHIC |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 2 CHANNEL |
| end_item_identification | C-2A ACFT A |
| inclosure_configuration | DUAL-IN-LINE |
| maximum_power_dissipation_rating | 200.0 MILLIWATTS |
| NSN | 5962-01-219-0992 |
| MAXIMUM POWER DISSIPATION RATING | 200.0 MILLIWATTS |
| FEATURES PROVIDED | BURN IN AND HERMETICALLY SEALED AND MONOLITHIC |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| BODY LENGTH | 0.790 INCHES NOMINAL IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| BODY WIDTH | 0.330 INCHES NOMINAL IN |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INPUT CIRCUIT PATTERN | 2 CHANNEL |