The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.170 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.000 INCHES MINIMUM IN, overall_diameter: 0.076 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-201-7132, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.170 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.000 INCHES MINIMUM IN |
| overall_diameter | 0.076 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| power_rating_per_characteristic | 20.0 MILLIWATTS MAXIMUM FORWARD POWER DISSIPATION, DC |
| current_rating_per_characteristic | 0.10 MICROAMPERES MAXIMUM REVERSE CURRENT, DC |
| voltage_rating_in_volts_per_characteristic | 0.4 MAXIMUM FORWARD VOLTAGE, PEAK |
| maximum_operating_temp_per_measurement_point | 85.0 CELSIUS AMBIENT AIR DEGC |
| NSN | 5961-00-201-7132 |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 0.4 MAXIMUM FORWARD VOLTAGE, PEAK |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| MOUNTING METHOD | TERMINAL |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 85.0 CELSIUS AMBIENT AIR DEGC |
| CURRENT RATING PER CHARACTERISTIC | 0.10 MICROAMPERES MAXIMUM REVERSE CURRENT, DC |
| OVERALL LENGTH | 0.170 INCHES MAXIMUM IN |
| TERMINAL LENGTH | 1.000 INCHES MINIMUM IN |
| OVERALL DIAMETER | 0.076 INCHES MAXIMUM IN |
| POWER RATING PER CHARACTERISTIC | 20.0 MILLIWATTS MAXIMUM FORWARD POWER DISSIPATION, DC |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |