The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_height: 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND HYBRID AND W/BUFFERED OUTPUT AND POSITIVE OUTPUTS, inclosure_material: GLASS AND METAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: +0.0 TO 70.0 CELSIUS DEGC, body_outside_diameter: 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-056-1924, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_height | 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND HYBRID AND W/BUFFERED OUTPUT AND POSITIVE OUTPUTS |
| inclosure_material | GLASS AND METAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | +0.0 TO 70.0 CELSIUS DEGC |
| body_outside_diameter | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN |
| input_circuit_pattern | 5 INPUT |
| inclosure_configuration | CAN |
| terminal_surface_treatment | TIN |
| design_function_and_quantity | 1 AMPLIFIER, OPERATIONAL, GENERAL PURPOSE |
| maximum_power_dissipation_rating | 500.0 MILLIWATTS |
| case_outline_source_and_designator | T0-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| NSN | 5962-00-056-1924 |