SK35GD126ET: MICROCIRCUIT SET.
The MICROCIRCUIT SET is a the manufacturer industrial component. Key specifications include features_provided: ELECTROSTATIC SENSITIVE, inclosure_material: CERAMIC, part_name_assigned_by_controlling_agency: IGBT MODULE. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-718-0265, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| special_features | ONE SCREW MOUNTING, HEAT TRANSFER AND ISOLATION THROUGH DIRECT COPPER BONDED ALUMINIUM OXIDE CERAMIC, HEAT TRANSFER AND ISOLATION THROUGH DIRECT COPPER BONDED ALUMINIUM OXIDE CERAMIC (DCB) |
| features_provided | ELECTROSTATIC SENSITIVE |
| inclosure_material | CERAMIC |
| part_name_assigned_by_controlling_agency | IGBT MODULE |
| NSN | 5962-01-718-0265 |
| INCLOSURE MATERIAL | CERAMIC |
| FEATURES PROVIDED | ELECTROSTATIC SENSITIVE |
| SPECIAL FEATURES | ONE SCREW MOUNTING, HEAT TRANSFER AND ISOLATION THROUGH DIRECT COPPER BONDED ALUMINIUM OXIDE CERAMIC, HEAT TRANSFER AND ISOLATION THROUGH DIRECT COPPER BONDED ALUMINIUM OXIDE CERAMIC (DCB) |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | IGBT MODULE |
No substitute or cross-reference records for this part.