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Technical Data Sheet
SE555F ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 0.291 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 0.400 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND W/RESISTOR AND W/RESET AND POSITIVE OUTPUTS, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-062-3079, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
SE555F
NSN: 5962-01-062-3079
FSC: 5962
CAGE: 18324 — PHILIPS SEMICONDUCTORS INC (USA)
SPECIFICATIONS
body_width0.291 INCHES MAXIMUM IN
body_height0.180 INCHES MAXIMUM IN
body_length0.400 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND W/RESISTOR AND W/RESET AND POSITIVE OUTPUTS
inclosure_materialCERAMIC
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern4 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
terminal_type_and_quantity8 PRINTED CIRCUIT
design_function_and_quantity1 TIMER
NSN5962-01-062-3079
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,LINEAR TITLE COMPONENT PN SE555F MFR MICROCIRCUIT,LINEAR
KEY FEATURES
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
TERMINAL SURFACE TREATMENT: SOLDER
FEATURES PROVIDED: HERMETICALLY SEALED AND W/RESISTOR AND W/RESET AND POSITIVE OUTPUTS
MAXIMUM POWER DISSIPATION RATING: 600.0 MILLIWATTS
BODY WIDTH: 0.302 INCHES MAXIMUM IN
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
BODY HEIGHT: 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN
TECHNICAL CHARACTERISTICS (FLIS)
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
TERMINAL SURFACE TREATMENTSOLDER
FEATURES PROVIDEDHERMETICALLY SEALED AND W/RESISTOR AND W/RESET AND POSITIVE OUTPUTS
MAXIMUM POWER DISSIPATION RATING600.0 MILLIWATTS
BODY WIDTH0.302 INCHES MAXIMUM IN
INCLOSURE CONFIGURATIONDUAL-IN-LINE
INCLOSURE MATERIALCERAMIC
BODY HEIGHT0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
INPUT CIRCUIT PATTERN3 INPUT
VERIFIED SUBSTITUTES & CROSS-REFERENCES 4
161-377-1101Interchangeable
interchangeable cross-reference
interchangeable
SE555JInterchangeable
interchangeable cross-reference
interchangeable
755017A4213Interchangeable
Same NIIN cross-reference
interchangeable
CA555F4Interchangeable
Same NIIN cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is SE555F?
SE555F is a MICROCIRCUIT,LINEAR.
What parts can replace SE555F?
There are 4 known substitutes for SE555F: 161-377-1101, SE555J, 755017A4213 and 1 more. Substitute compatibility should be verified for your specific system.
What is the NSN for SE555F?
SE555F is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-062-3079. This indicates validated use in U.S. government and defense supply chains.
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