The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.051 INCHES MINIMUM AND 0.063 INCHES MAXIMUM IN, body_length: 0.330 INCHES MINIMUM AND 0.350 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND W/RESISTOR AND POSITIVE OUTPUTS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-053-7978, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| body_height | 0.051 INCHES MINIMUM AND 0.063 INCHES MAXIMUM IN |
| body_length | 0.330 INCHES MINIMUM AND 0.350 INCHES MAXIMUM IN |
| features_provided | MONOLITHIC AND W/RESISTOR AND POSITIVE OUTPUTS |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 10 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 14 FLAT LEADS |
| NSN | 5962-00-053-7978 |
| FEATURES PROVIDED | HERMETICALLY SEALED |
| INCLOSURE CONFIGURATION | FLAT PACK |
| INPUT CIRCUIT PATTERN | 4 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| DESIGN FUNCTION AND QUANTITY | 1 GATE, NAND |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| BODY HEIGHT | 0.065 INCHES NOMINAL IN |
| BODY LENGTH | 0.350 INCHES NOMINAL IN |
| BODY WIDTH | 0.260 INCHES NOMINAL IN |