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Technical Data Sheet
SDG2325 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.796 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND HERMETICALLY SEALED, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-041-0228, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
SDG2325
NSN: 5962-01-041-0228
FSC: 5962
CAGE: 17856 — SILICONIX INCORPORATED DIV SILICONIX (USA)
SPECIFICATIONS
body_width0.310 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length0.796 INCHES MAXIMUM IN
features_providedMONOLITHIC AND HERMETICALLY SEALED
output_logic_formMETAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern10 INPUT
inclosure_configurationDUAL-IN-LINE
design_function_and_quantity5 DRIVER, SWITCH
maximum_power_dissipation_rating750.0 MILLIWATTS
NSN5962-01-041-0228
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN SDG2325 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
MAXIMUM POWER DISSIPATION RATING: 750.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
BODY WIDTH: 0.310 INCHES MAXIMUM IN
OUTPUT LOGIC FORM: METAL OXIDE-SEMICONDUCTOR LOGIC
FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED
DESIGN FUNCTION AND QUANTITY: 5 DRIVER, SWITCH
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
INCLOSURE CONFIGURATION: DUAL-IN-LINE
TECHNICAL CHARACTERISTICS (FLIS)
MAXIMUM POWER DISSIPATION RATING750.0 MILLIWATTS
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
BODY WIDTH0.310 INCHES MAXIMUM IN
OUTPUT LOGIC FORMMETAL OXIDE-SEMICONDUCTOR LOGIC
FEATURES PROVIDEDMONOLITHIC AND HERMETICALLY SEALED
DESIGN FUNCTION AND QUANTITY5 DRIVER, SWITCH
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
INCLOSURE CONFIGURATIONDUAL-IN-LINE
BODY HEIGHT0.185 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN10 INPUT
VERIFIED SUBSTITUTES & CROSS-REFERENCES 28
ES3972-008Interchangeable
interchangeable cross-reference
interchangeable
DG139AP883BInterchangeable
interchangeable cross-reference
interchangeable
ITS7567Interchangeable
interchangeable cross-reference
interchangeable
DG123PInterchangeable
interchangeable cross-reference
interchangeable
932246-1BInterchangeable
interchangeable cross-reference
interchangeable
IH5010MDDInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is SDG2325?
SDG2325 is a MICROCIRCUIT,DIGITAL.
What parts can replace SDG2325?
There are 28 known substitutes for SDG2325: ES3972-008, DG139AP883B, ITS7567 and 25 more. Substitute compatibility should be verified for your specific system.
What is the NSN for SDG2325?
SDG2325 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-041-0228. This indicates validated use in U.S. government and defense supply chains.
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