The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.220 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.000 INCHES MINIMUM AND 1.620 INCHES MAXIMUM IN, overall_diameter: 0.360 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5999-00-204-5222, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.220 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.000 INCHES MINIMUM AND 1.620 INCHES MAXIMUM IN |
| overall_diameter | 0.360 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| current_rating_per_characteristic | 600.00 MILLIAMPERES MAXIMUM AVERAGE ON-STATE CURRENT, 180 DEGREES CONDUCTION ANGLE, AVERAGE OVER A FULL 60-HZ CYCLE |
| voltage_rating_in_volts_per_characteristic | 100.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| maximum_operating_temp_per_measurement_point | 125.0 CELSIUS AMBIENT AIR DEGC |
| NSN | 5999-00-204-5222 |
| MATERIAL | COPPER ALLOY BODY |
| MATERIAL | CERAMIC BODY INSULATION |
| HOLE ACCOMMODATION DIAMETER | 0.375 INCHES NOMINAL IN |
| CABLE ENTRANCE DIAMETER | 0.219 INCHES NOMINAL IN |
| OVERALL WIDTH | 0.625 INCHES NOMINAL IN |
| OVERALL LENGTH | 1.125 INCHES NOMINAL IN |
| TERMINAL TYPE AND QUANTITY | 1 TAB, SOLDER LUG AXIALLY AT ONE END |
| STYLE DESIGNATOR | GRID PLATE CLIP |
| SURFACE TREATMENT | TIN BODY |
| OVERALL HEIGHT | 0.562 INCHES NOMINAL IN |