The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN, body_length: 0.440 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE AND W/PRESET AND W/CLOCK, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC OR METAL. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-217-4213, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN |
| body_height | 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN |
| body_length | 0.440 INCHES MAXIMUM IN |
| features_provided | ELECTROSTATIC SENSITIVE AND W/PRESET AND W/CLOCK |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC OR METAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 9 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-217-4213 |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| INPUT CIRCUIT PATTERN | 9 INPUT |
| CASE OUTLINE SOURCE AND DESIGNATOR | F-5 MIL-M-38510 |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| BODY WIDTH | 0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| INCLOSURE CONFIGURATION | FLAT PACK |