The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.520 INCHES MAXIMUM IN, mounting_method: THREADED STUD(S), overall_diameter: 1.250 INCHES MAXIMUM IN, special_features: JUNCTION PATTERN ARRANGEMENT: NPN, features_provided: HERMETICALLY SEALED CASE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-400-9055, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.520 INCHES MAXIMUM IN |
| mounting_method | THREADED STUD(S) |
| overall_diameter | 1.250 INCHES MAXIMUM IN |
| special_features | JUNCTION PATTERN ARRANGEMENT: NPN |
| features_provided | HERMETICALLY SEALED CASE |
| nominal_thread_size | 0.190 INCHES IN |
| internal_configuration | JUNCTION CONTACT |
| semiconductor_material | SILICON |
| thread_series_designator | UNF |
| mounting_facility_quantity | 1 |
| terminal_type_and_quantity | 2 PIN AND 1 CASE |
| NSN | 5961-00-400-9055 |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| MATERIAL | SILICON SEMICONDUCTOR |